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Lei Luo 0006
Person information
- affiliation: Rambus Inc., Chapel Hill, NC, USA
- affiliation: North Carolina State University, Department of Electrical and Computer Engineering, Raleigh, NC, USA
Other persons with the same name
- Lei Luo — disambiguation page
- Lei Luo 0001 — Nanjing University of Science and Technology, School of Computer Science and Engineering, China (and 1 more)
- Lei Luo 0002 — National University of Defense Technology, College of Computer, Changsha, China
- Lei Luo 0003 — Chongqing University of Posts and Telecommunications, School of Communication and Information Engineering, Chongqing, China (and 1 more)
- Lei Luo 0004 — University of Electronic Science and Technology of China, School of Computer Science and Engineering, Chengdu, China
- Lei Luo 0005 — Chinese Academy of Sciences, Aerospace Information Research Institute, Beijing, China (and 2 more)
- Lei Luo 0007 — Kansas State University, Manhattan, KS, USA
- Lei Luo 0008 — Beijing University of Posts and Telecommunications, School of Artificial Intelligence, Beijing, China (and 2 more)
- Lei Luo 0009 — Chongqing University, Key Laboratory of Optoelectronic Technology and Systems, Chongqing, China (and 1 more)
- Lei Luo 0010 — Wuhan Textile University, China (and 1 more)
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2010 – 2019
- 2014
- [j5]Michael Bucher, Ravi T. Kollipara, Bruce Su, Liji Gopalakrishnan, Kashinath Prabhu, Pravin Kumar Venkatesan, Kambiz Kaviani, Barry Daly, William F. Stonecypher, Wayne D. Dettloff, Teva Stone, Fred Heaton, Yi Lu, Chris J. Madden, Sanath Bangalore, John C. Eble, Nhat Nguyen, Lei Luo:
A 6.4-Gb/s Near-Ground Single-Ended Transceiver for Dual-Rank DIMM Memory Interface Systems. IEEE J. Solid State Circuits 49(1): 127-139 (2014) - 2013
- [c6]Kambiz Kaviani, Michael Bucher, Bruce Su, Barry Daly, Bill Stonecypher, Wayne D. Dettloff, Teva Stone, Kashinath Prabhu, Pravin Kumar Venkatesan, Fred Heaton, Ravi T. Kollipara, Yi Lu, Chris J. Madden, John C. Eble, Lei Luo, Nhat Nguyen:
A 6.4Gb/s near-ground single-ended transceiver for dual-rank DIMM memory interface systems. ISSCC 2013: 306-307 - 2011
- [j4]Jared Zerbe, Barry Daly, Lei Luo, Bill Stonecypher, Wayne D. Dettloff, John C. Eble, Teva Stone, Jihong Ren, Brian S. Leibowitz, Michael Bucher, Patrick Satarzadeh, Qi Lin, Yue Lu, Ravi T. Kollipara:
A 5 Gb/s Link With Matched Source Synchronous and Common-Mode Clocking Techniques. IEEE J. Solid State Circuits 46(4): 974-985 (2011) - [c5]John C. Eble, Scott Best, Brian S. Leibowitz, Lei Luo, Robert Palmer, John M. Wilson, Jared Zerbe, Amir Amirkhany, Nhat Nguyen:
Power-efficient I/O design considerations for high-bandwidth applications. CICC 2011: 1-8 - 2010
- [c4]Wayne D. Dettloff, John C. Eble, Lei Luo, Pravin Kumar Venkatesan, Fred Heaton, Teva Stone, Barry Daly:
A 32mW 7.4Gb/s protocol-agile source-series-terminated transmitter in 45nm CMOS SOI. ISSCC 2010: 370-371
2000 – 2009
- 2009
- [j3]Liang Zhang, John M. Wilson, Rizwan Bashirullah, Lei Luo, Jian Xu, Paul D. Franzon:
A 32-Gb/s On-Chip Bus With Driver Pre-Emphasis Signaling. IEEE Trans. Very Large Scale Integr. Syst. 17(9): 1267-1274 (2009) - 2007
- [j2]Liang Zhang, John M. Wilson, Rizwan Bashirullah, Lei Luo, Jian Xu, Paul D. Franzon:
Voltage-Mode Driver Preemphasis Technique For On-Chip Global Buses. IEEE Trans. Very Large Scale Integr. Syst. 15(2): 231-236 (2007) - 2006
- [j1]Lei Luo, John M. Wilson, Stephen E. Mick, Jian Xu, Liang Zhang, Paul D. Franzon:
3 gb/s AC coupled chip-to-chip communication using a low swing pulse receiver. IEEE J. Solid State Circuits 41(1): 287-296 (2006) - [c3]Liang Zhang, John M. Wilson, Rizwan Bashirullah, Lei Luo, Jian Xu, Paul D. Franzon:
A 32Gb/s On-chip Bus with Driver Pre-emphasis Signaling. CICC 2006: 265-268 - [c2]Lei Luo, John M. Wilson, Stephen E. Mick, Jian Xu, Liang Zhang, Evan Erickson, Paul D. Franzon:
A 36Gb/s ACCI Multi-Channel Bus using a Fully Differential Pulse Receiver. CICC 2006: 773-776 - 2005
- [c1]Liang Zhang, John M. Wilson, Rizwan Bashirullah, Lei Luo, Jian Xu, Paul D. Franzon:
Driver pre-emphasis techniques for on-chip global buses. ISLPED 2005: 186-191
Coauthor Index
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