AVD® technology for deposition of next generation devices.

Sat, 01 Jan 2005 00:00:00 +0100

U. Weber, M. Schumacher, J. Lindner, O. Boissière, P. Lehnen, S. Miedl, P. K. Baumann, G. Barbar, C. Lohe, T. McEntee:
AVD® technology for deposition of next generation devices. Microelectron. Reliab. 45(5-6): 945-948 (2005)