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2020 – today
- 2024
[j10]Shiliang Zhu
, Min Miao:
SCNet: A Lightweight and Efficient Object Detection Network for Remote Sensing. IEEE Geosci. Remote. Sens. Lett. 21: 1-5 (2024)- [j9]Yutong Wang, Min Miao, Shiliang Zhu:
L-ENet: An Ultralightweight SAR Image Detection Network. IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens. 17: 8967-8978 (2024) - 2023
- [j8]Xuena Liu, Zhensong Li, Hao Wen, Min Miao, Yuduo Wang, Zhuwei Wang:
A PAM4 transceiver design scheme with threshold adaptive and tap adaptive. EURASIP J. Adv. Signal Process. 2023(1): 70 (2023) - [j7]Weiheng Zhao, Yudi Zhao, Min Miao:
A physics-based modeling method of THz Schottky diode for circuit simulation. Microelectron. J. 136: 105775 (2023) - 2022
- [j6]Min Miao, Danya Zhang, Xin Nie, Jingpeng Bu:
A compact and cost effective quasi-in-situ method to characterize broadband RF shielding effectiveness of materials for advanced microelectronic packaging. Microelectron. J. 129: 105582 (2022) - [c10]Xuena Liu, Zhensong Li, Hao Wen, Min Miao:
Design of 20Gb/s PAM4 Transmitter with 2-tap FFE. CISP-BMEI 2022: 1-6 - [c9]Haitao He, Changhao Luo, Junchen Dong, Yudi Zhao, Min Miao, Kai Zhao:
TSV Defects Classification with Machine Learning Approaches. ICTA 2022: 54-55 - 2021
- [j5]Na Li, Min Miao:
Design of EMI and suppression structure based on bar-via. Microelectron. J. 112: 105049 (2021) - [c8]Zhuanzhuan Zhang, Min Miao, Xiaolong Duan:
Compact Modeling and Analysis of a Typical Inter-Chiplet Serial High Speed Link on an Active Interposer. ICTA 2021: 65-68 - 2020
- [j4]Zhensong Li, Min Miao, Zhuwei Wang:
Parallel Coding Scheme With Turbo Product Code for Mobile Multimedia Transmission in MIMO-FBMC System. IEEE Access 8: 3772-3780 (2020)
2010 – 2019
- 2018
- [j3]Haoyang Li, Hong Zheng, Chuanzhao Han, Haibo Wang, Min Miao:
Onboard Spectral and Spatial Cloud Detection for Hyperspectral Remote Sensing Images. Remote. Sens. 10(1): 152 (2018) - [c7]Xin Jin, Keliang Zhang, Xian Huang, Min Miao:
On Continuous Speech Recognition of Indian English. ACAI 2018: 74:1-74:6 - 2017
- [j2]Xiaole Cui, Xiaoxin Cui, Yewen Ni, Min Miao, Yufeng Jin:
An Enhancement of Crosstalk Avoidance Code Based on Fibonacci Numeral System for Through Silicon Vias. IEEE Trans. Very Large Scale Integr. Syst. 25(5): 1601-1610 (2017) - 2013
- [j1]Xin Sun, Yunhui Zhu, Zhen Hua Liu, Qing-hu Cui, Shenglin Ma, Jing Chen, Min Miao, Yufeng Jin:
Electrical characterization of integrated passive devices using thin film technology for 3D integration. J. Zhejiang Univ. Sci. C 14(4): 235-243 (2013) - [c6]Zhiyuan Zhu, Shaonan Wang, Yichao Xu, Guanjiang Wang, Yudan Pi, Peiquan Wang, Yunhui Zhu, Xin Sun, Min Yu, Jing Chen, Min Miao, Yufeng Jin:
Investigations of silicon wafer bonding using thin Al and Sn films for heterogeneous integration. NEMS 2013: 155-158 - [c5]Yichao Xu, Guanjiang Wang, Xin Sun, Runiu Fang, Min Miao, Yufeng Jin:
In-line testing of blind TSVs for 3D IC integration and M/NEMS packaging. NEMS 2013: 233-236 - 2012
- [c4]Songtao Jia, Min Miao, Runiu Fang, Shichao Guo, Duwei Hu, Yufeng Jin:
A 3D micro-channel cooling system embedded in LTCC packaging substrate. NEMS 2012: 649-652 - 2011
- [c3]Hua Gan, Yufeng Jin, Min Miao, Xin Sun:
A novel LTCC capacitive accelerometer embedded in LTCC packaging substrate. NEMS 2011: 796-799 - 2010
- [c2]Min Miao, Jing Zhang, Yunsong Qiu, Yangfei Zhang, Yufeng Jin, Hua Gan:
A LTCC microsystem vacuum package substrate with embedded cooling microchannel and Pirani gauge. NEMS 2010: 399-403
2000 – 2009
- 2009
- [c1]Min Miao, Yufeng Jin, Hongguang Liao, Liwei Zhao, Yunhui Zhu, Xin Sun, Yunxia Guo:
Research on deep RIE-based through-Si-via micromachining for 3-D system-in-package integration. NEMS 2009: 90-93
Coauthor Index
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