New dummy design and stiffener on warpage reduction in Ball Grid Array Printed Circuit Board.

Fri, 01 Jan 2010 00:00:00 +0100

Seunghyun Cho, Tae-Eun Chang, Joseph Y. Lee, Hyung-Pil Park , Youngbae Ko, GyunMyoung Park:
New dummy design and stiffener on warpage reduction in Ball Grid Array Printed Circuit Board. Microelectron. Reliab. 50(2): 242-250 (2010)