BibTeX records: Muriel de Potter de ten Broeck

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@inproceedings{DBLP:conf/vlsic/HellingsSDVBNLH15,
  author    = {Geert Hellings and
               Mirko Scholz and
               Mikael Detalle and
               Dimitrios Velenis and
               Muriel de Potter de ten Broeck and
               C. Roda Neve and
               Y. Li and
               Stefaan Van Huylenbroeck and
               Shih{-}Hung Chen and
               Erik Jan Marinissen and
               Antonio La Manna and
               Geert Van der Plas and
               Dimitri Linten and
               Eric Beyne and
               Aaron Thean},
  title     = {Active-lite interposer for 2.5 {\&} 3D integration},
  booktitle = {Symposium on {VLSI} Circuits, {VLSIC} 2015, Kyoto, Japan, June 17-19,
               2015},
  pages     = {222},
  publisher = {{IEEE}},
  year      = {2015},
  url       = {https://doi.org/10.1109/VLSIC.2015.7231374},
  doi       = {10.1109/VLSIC.2015.7231374},
  timestamp = {Wed, 10 Mar 2021 00:00:00 +0100},
  biburl    = {https://dblp.org/rec/conf/vlsic/HellingsSDVBNLH15.bib},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/jssc/PlasLLMOTTLSKVCVSWLPBMCROPBORWDNAPABDTBM11,
  author    = {Geert Van der Plas and
               Paresh Limaye and
               Igor Loi and
               Abdelkarim Mercha and
               Herman Oprins and
               Cristina Torregiani and
               Steven Thijs and
               Dimitri Linten and
               Michele Stucchi and
               Guruprasad Katti and
               Dimitrios Velenis and
               Vladimir Cherman and
               Bart Vandevelde and
               Veerle Simons and
               Ingrid De Wolf and
               Riet Labie and
               Dan Perry and
               Stephane Bronckers and
               Nikolaos Minas and
               Miro Cupac and
               Wouter Ruythooren and
               Jan Van Olmen and
               Alain Phommahaxay and
               Muriel de Potter de ten Broeck and
               Ann Opdebeeck and
               Michal Rakowski and
               Bart De Wachter and
               Morin Dehan and
               Marc Nelis and
               Rahul Agarwal and
               Antonio Pullini and
               Federico Angiolini and
               Luca Benini and
               Wim Dehaene and
               Youssef Travaly and
               Eric Beyne and
               Paul Marchal},
  title     = {Design Issues and Considerations for Low-Cost 3-D {TSV} {IC} Technology},
  journal   = {{IEEE} J. Solid State Circuits},
  volume    = {46},
  number    = {1},
  pages     = {293--307},
  year      = {2011},
  url       = {https://doi.org/10.1109/JSSC.2010.2074070},
  doi       = {10.1109/JSSC.2010.2074070},
  timestamp = {Sun, 30 Aug 2020 01:00:00 +0200},
  biburl    = {https://dblp.org/rec/journals/jssc/PlasLLMOTTLSKVCVSWLPBMCROPBORWDNAPABDTBM11.bib},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/isscc/PlasLMOTTLSKVSCVSWLPBMCROPBORWDNADTMB10,
  author    = {Geert Van der Plas and
               Paresh Limaye and
               Abdelkarim Mercha and
               Herman Oprins and
               Cristina Torregiani and
               Steven Thijs and
               Dimitri Linten and
               Michele Stucchi and
               Guruprasad Katti and
               Dimitrios Velenis and
               Domae Shinichi and
               Vladimir Cherman and
               Bart Vandevelde and
               Veerle Simons and
               Ingrid De Wolf and
               Riet Labie and
               Dan Perry and
               Stephane Bronckers and
               Nikolaos Minas and
               Miro Cupac and
               Wouter Ruythooren and
               Jan Van Olmen and
               Alain Phommahaxay and
               Muriel de Potter de ten Broeck and
               Ann Opdebeeck and
               Michal Rakowski and
               Bart De Wachter and
               Morin Dehan and
               Marc Nelis and
               Rahul Agarwal and
               Wim Dehaene and
               Youssef Travaly and
               Pol Marchal and
               Eric Beyne},
  title     = {Design issues and considerations for low-cost 3D {TSV} {IC} technology},
  booktitle = {{IEEE} International Solid-State Circuits Conference, {ISSCC} 2010,
               Digest of Technical Papers, San Francisco, CA, USA, 7-11 February,
               2010},
  pages     = {148--149},
  publisher = {{IEEE}},
  year      = {2010},
  url       = {https://doi.org/10.1109/ISSCC.2010.5434016},
  doi       = {10.1109/ISSCC.2010.5434016},
  timestamp = {Wed, 16 Oct 2019 14:14:55 +0200},
  biburl    = {https://dblp.org/rec/conf/isscc/PlasLMOTTLSKVSCVSWLPBMCROPBORWDNADTMB10.bib},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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