Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP.

Fri, 01 Jan 2010 00:00:00 +0100

Y. A. Su, Long Bin Tan , T. Y. Tee, Vincent B. C. Tan:
Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP. Microelectron. Reliab. 50(4): 564-576 (2010)