Mapping the failure envelope of board-level solder joints.

Thu, 01 Jan 2009 00:00:00 +0100

Long Bin Tan , Xiaowu Zhang , Chwee Teck Lim , Vincent B. C. Tan:
Mapping the failure envelope of board-level solder joints. Microelectron. Reliab. 49(4): 397-409 (2009)