BibTeX record conf/3dic/HuangTCSLCCHCTC13

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@inproceedings{DBLP:conf/3dic/HuangTCSLCCHCTC13,
  author       = {Yan{-}Pin Huang and
                  Ruoh{-}Ning Tzeng and
                  Yu{-}San Chien and
                  Ming{-}Shaw Shy and
                  Teu{-}Hua Lin and
                  Kuo{-}Hua Chen and
                  Ching{-}Te Chuang and
                  Wei Hwang and
                  Chi{-}Tsung Chiu and
                  Ho{-}Ming Tong and
                  Kuan{-}Neng Chen},
  title        = {Low temperature ({\textless}180 {\textdegree}C) bonding for 3D integration},
  booktitle    = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
                  San Francisco, CA, USA, October 2-4, 2013},
  pages        = {1--5},
  publisher    = {{IEEE}},
  year         = {2013},
  url          = {https://doi.org/10.1109/3DIC.2013.6702319},
  doi          = {10.1109/3DIC.2013.6702319},
  timestamp    = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/HuangTCSLCCHCTC13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}