BibTeX record conf/3dic/JoblotFHJCGAFCFLC13

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@inproceedings{DBLP:conf/3dic/JoblotFHJCGAFCFLC13,
  author       = {Sylvain Joblot and
                  Alexis Farcy and
                  Nicolas Hotellier and
                  Amadine Jouve and
                  Fran{\c{c}}ois de Crecy and
                  Arnaud Garnier and
                  M. Argoud and
                  C. Ferrandon and
                  J.{-}P. Colonna and
                  R. Franiatte and
                  C. Laviron and
                  S{\'{e}}verine Cheramy},
  title        = {Wafer level encapsulated materials evaluation for chip on wafer (CoW)
                  approach in 2.5D Si interposer integration},
  booktitle    = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
                  San Francisco, CA, USA, October 2-4, 2013},
  pages        = {1--7},
  publisher    = {{IEEE}},
  year         = {2013},
  url          = {https://doi.org/10.1109/3DIC.2013.6702394},
  doi          = {10.1109/3DIC.2013.6702394},
  timestamp    = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/JoblotFHJCGAFCFLC13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}