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BibTeX record conf/3dic/TehCQAOGMSMCWMGD09
@inproceedings{DBLP:conf/3dic/TehCQAOGMSMCWMGD09, author = {Weng Hong Teh and Raymond Caramto and Jamal Qureshi and Sitaram Arkalgud and M. O'Brien and T. Gilday and Kou Maekawa and T. Saito and Kouichi Maruyama and Thenappan Chidambaram and Wei Wang and David Marx and David Grant and Russ Dudley}, title = {A route towards production-worthy 5 {\(\mathrm{\mu}\)}m {\texttimes} 25 {\(\mathrm{\mu}\)}m and 1 {\(\mathrm{\mu}\)}m {\texttimes} 20 {\(\mathrm{\mu}\)}m non-Bosch through-silicon-via {(TSV)} etch, {TSV} metrology, and {TSV} integration}, booktitle = {{IEEE} International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009}, pages = {1--5}, publisher = {{IEEE}}, year = {2009}, url = {https://doi.org/10.1109/3DIC.2009.5306562}, doi = {10.1109/3DIC.2009.5306562}, timestamp = {Wed, 16 Oct 2019 14:14:50 +0200}, biburl = {https://dblp.org/rec/conf/3dic/TehCQAOGMSMCWMGD09.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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