BibTeX record conf/cicc/SakuiO19

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@inproceedings{DBLP:conf/cicc/SakuiO19,
  author    = {Koji Sakui and
               Takayuki Ohba},
  title     = {Three-dimensional Integration {(3DI)} with Bumpless Interconnects
               for Tera-scale Generation : High Speed, Low Power, and Ultra-small
               Operating Platform},
  booktitle = {{IEEE} Custom Integrated Circuits Conference, {CICC} 2019, Austin,
               TX, USA, April 14-17, 2019},
  pages     = {1--6},
  year      = {2019},
  crossref  = {DBLP:conf/cicc/2019},
  url       = {https://doi.org/10.1109/CICC.2019.8780385},
  doi       = {10.1109/CICC.2019.8780385},
  timestamp = {Wed, 16 Oct 2019 14:14:52 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/cicc/SakuiO19},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@proceedings{DBLP:conf/cicc/2019,
  title     = {{IEEE} Custom Integrated Circuits Conference, {CICC} 2019, Austin,
               TX, USA, April 14-17, 2019},
  publisher = {{IEEE}},
  year      = {2019},
  url       = {https://ieeexplore.ieee.org/xpl/conhome/8767369/proceeding},
  isbn      = {978-1-5386-9395-7},
  timestamp = {Wed, 16 Oct 2019 14:14:52 +0200},
  biburl    = {https://dblp.org/rec/bib/conf/cicc/2019},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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