BibTeX record conf/itc/ChiMGW11

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@inproceedings{DBLP:conf/itc/ChiMGW11,
  author       = {Chun{-}Chuan Chi and
                  Erik Jan Marinissen and
                  Sandeep Kumar Goel and
                  Cheng{-}Wen Wu},
  editor       = {Bill Eklow and
                  R. D. (Shawn) Blanton},
  title        = {Post-bond testing of 2.5D-SICs and 3D-SICs containing a passive silicon
                  interposer base},
  booktitle    = {2011 {IEEE} International Test Conference, {ITC} 2011, Anaheim, CA,
                  USA, September 20-22, 2011},
  pages        = {1--10},
  publisher    = {{IEEE} Computer Society},
  year         = {2011},
  url          = {https://doi.org/10.1109/TEST.2011.6139181},
  doi          = {10.1109/TEST.2011.6139181},
  timestamp    = {Mon, 05 Feb 2024 20:31:29 +0100},
  biburl       = {https://dblp.org/rec/conf/itc/ChiMGW11.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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