BibTeX record journals/ieiceee/WangY15

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@article{DBLP:journals/ieiceee/WangY15,
  author       = {Fengjuan Wang and
                  Ningmei Yu},
  title        = {Study on thermal stress and keep-out zone induced by Cu and SiO\({}_{\mbox{2}}\)
                  filled coaxial-annular through-silicon via},
  journal      = {{IEICE} Electron. Express},
  volume       = {12},
  number       = {22},
  pages        = {20150844},
  year         = {2015},
  url          = {https://doi.org/10.1587/elex.12.20150844},
  doi          = {10.1587/ELEX.12.20150844},
  timestamp    = {Fri, 12 Feb 2021 22:20:12 +0100},
  biburl       = {https://dblp.org/rec/journals/ieiceee/WangY15.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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