BibTeX record journals/ieiceee/WangZYLD13

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@article{DBLP:journals/ieiceee/WangZYLD13,
  author       = {Fengjuan Wang and
                  Zhangming Zhu and
                  Yintang Yang and
                  Xiaoxian Liu and
                  Ruixue Ding},
  title        = {Analytical models for the thermal strain and stress induced by annular
                  through-silicon-via {(TSV)}},
  journal      = {{IEICE} Electron. Express},
  volume       = {10},
  number       = {20},
  pages        = {20130666},
  year         = {2013},
  url          = {https://doi.org/10.1587/elex.10.20130666},
  doi          = {10.1587/ELEX.10.20130666},
  timestamp    = {Fri, 12 Feb 2021 22:21:29 +0100},
  biburl       = {https://dblp.org/rec/journals/ieiceee/WangZYLD13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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