BibTeX record journals/mr/JinkaDGL09

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@article{DBLP:journals/mr/JinkaDGL09,
  author    = {K. K. Jinka and
               A. Dasgupta and
               S. Ganesan and
               S. Ling},
  title     = {Chip-on board technology for low temperature environment. Part {II:}
               Thermomechanical stresses in encapsulated ball-wedge bond wires},
  journal   = {Microelectron. Reliab.},
  volume    = {49},
  number    = {5},
  pages     = {523--529},
  year      = {2009},
  url       = {https://doi.org/10.1016/j.microrel.2009.02.008},
  doi       = {10.1016/j.microrel.2009.02.008},
  timestamp = {Sat, 22 Feb 2020 19:29:30 +0100},
  biburl    = {https://dblp.org/rec/journals/mr/JinkaDGL09.bib},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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