BibTeX record journals/mr/MelamedWNSKA17

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@article{DBLP:journals/mr/MelamedWNSKA17,
  author       = {Samson Melamed and
                  Naoya Watanabe and
                  Shunsuke Nemoto and
                  Haruo Shimamoto and
                  Katsuya Kikuchi and
                  Masahiro Aoyagi},
  title        = {Thermal impact of extreme die thinning in bump-bonded three-dimensional
                  integrated circuits},
  journal      = {Microelectron. Reliab.},
  volume       = {79},
  pages        = {380--386},
  year         = {2017},
  url          = {https://doi.org/10.1016/j.microrel.2017.05.030},
  doi          = {10.1016/J.MICROREL.2017.05.030},
  timestamp    = {Sat, 22 Feb 2020 19:27:14 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/MelamedWNSKA17.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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