BibTeX record journals/mr/QinSHMMZ11

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@article{DBLP:journals/mr/QinSHMMZ11,
  author       = {I. Qin and
                  Aashish Shah and
                  C. Huynh and
                  M. Meyer and
                  M. Mayer and
                  Norman Y. Zhou},
  title        = {Role of process parameters on bondability and pad damage indicators
                  in copper ball bonding},
  journal      = {Microelectron. Reliab.},
  volume       = {51},
  number       = {1},
  pages        = {60--66},
  year         = {2011},
  url          = {https://doi.org/10.1016/j.microrel.2010.04.001},
  doi          = {10.1016/J.MICROREL.2010.04.001},
  timestamp    = {Mon, 13 Nov 2023 20:30:31 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/QinSHMMZ11.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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