BibTeX record journals/mr/UsuiSKTHSK17

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@article{DBLP:journals/mr/UsuiSKTHSK17,
  author       = {Masanori Usui and
                  Toshikazu Satoh and
                  Hidehiko Kimura and
                  S. Tajima and
                  Y. Hayashi and
                  Daigo Setoyama and
                  Masashi Kato},
  title        = {Effects of thermal aging on Cu nanoparticle/Bi-Sn solder hybrid bonding},
  journal      = {Microelectron. Reliab.},
  volume       = {78},
  pages        = {93--99},
  year         = {2017},
  url          = {https://doi.org/10.1016/j.microrel.2017.07.096},
  doi          = {10.1016/J.MICROREL.2017.07.096},
  timestamp    = {Sat, 30 Sep 2023 10:21:35 +0200},
  biburl       = {https://dblp.org/rec/journals/mr/UsuiSKTHSK17.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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