BibTeX record journals/tcad/JungMPL12

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@article{DBLP:journals/tcad/JungMPL12,
  author       = {Moongon Jung and
                  Joydeep Mitra and
                  David Z. Pan and
                  Sung Kyu Lim},
  title        = {{TSV} Stress-Aware Full-Chip Mechanical Reliability Analysis and Optimization
                  for 3-D {IC}},
  journal      = {{IEEE} Trans. Comput. Aided Des. Integr. Circuits Syst.},
  volume       = {31},
  number       = {8},
  pages        = {1194--1207},
  year         = {2012},
  url          = {https://doi.org/10.1109/TCAD.2012.2188400},
  doi          = {10.1109/TCAD.2012.2188400},
  timestamp    = {Sun, 02 Oct 2022 15:50:16 +0200},
  biburl       = {https://dblp.org/rec/journals/tcad/JungMPL12.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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