BibTeX record journals/tie/ZhangWWYB19

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@article{DBLP:journals/tie/ZhangWWYB19,
  author       = {Yi Zhang and
                  Huai Wang and
                  Zhongxu Wang and
                  Yongheng Yang and
                  Frede Blaabjerg},
  title        = {Simplified Thermal Modeling for {IGBT} Modules With Periodic Power
                  Loss Profiles in Modular Multilevel Converters},
  journal      = {{IEEE} Trans. Ind. Electron.},
  volume       = {66},
  number       = {3},
  pages        = {2323--2332},
  year         = {2019},
  url          = {https://doi.org/10.1109/TIE.2018.2823664},
  doi          = {10.1109/TIE.2018.2823664},
  timestamp    = {Fri, 22 May 2020 15:34:17 +0200},
  biburl       = {https://dblp.org/rec/journals/tie/ZhangWWYB19.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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