BibTeX record journals/tr/YangLZTW13

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@article{DBLP:journals/tr/YangLZTW13,
  author    = {Ping Yang and
               Dongjing Liu and
               Yanfang Zhao and
               Yunqing Tang and
               Huan Wang},
  title     = {Approach on the Life-Prediction of Solder Joint for Electronic Packaging
               Under Combined Loading},
  journal   = {{IEEE} Trans. Reliability},
  volume    = {62},
  number    = {4},
  pages     = {870--875},
  year      = {2013},
  url       = {https://doi.org/10.1109/TR.2013.2285038},
  doi       = {10.1109/TR.2013.2285038},
  timestamp = {Sat, 19 Oct 2019 19:18:09 +0200},
  biburl    = {https://dblp.org/rec/bib/journals/tr/YangLZTW13},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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