"RF characterization of substrate coupling between TSV and MOS transistors ..."

Melanie Brocard et al. (2013)

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DOI: 10.1109/3DIC.2013.6702331

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Melanie Brocard, Cédric Bermond, Thierry Lacrevaz, Alexis Farcy, Patrick Le Maitre, P. Scheer, Patrick Leduc, Séverine Cheramy, Bernard Fléchet:
RF characterization of substrate coupling between TSV and MOS transistors in 3D integrated circuits. 3DIC 2013: 1-8

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