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"3D TSV based high frequency components for RF IC and RF MEMS applications."
Montserrat Fernandez-Bolaños et al. (2016)
- Montserrat Fernandez-Bolaños, Wolfgang A. Vitale, Mariazel Maqueda Lopez, Adrian M. Ionescu, Armin Klumpp, Karl-Reinhard Merkel, Josef Weber, Peter Ramm, Ilja Ocket, Walter De Raedt, Amin Enayati:
3D TSV based high frequency components for RF IC and RF MEMS applications. 3DIC 2016: 1-4
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