"Evaluation of alignment accuracy on chip-to-wafer self-assembly and ..."

Takafumi Fukushima et al. (2010)

> Home

Details and statistics

DOI: 10.1109/3DIC.2010.5751436

access: closed

type: Conference or Workshop Paper

metadata version: 2021-02-16

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/3dic/FukushimaIBMLTK10
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/3dic/FukushimaIBMLTK10
Takafumi Fukushima, Eiji Iwata, Jichoel Bea, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi:
Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature. 3DIC 2010: 1-5

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.