"Highly efficient TSV repair technology for resilient 3-D stacked multicore ..."

Hiroyuki Hashimoto et al. (2013)

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DOI: 10.1109/3DIC.2013.6702338

access: closed

type: Conference or Workshop Paper

metadata version: 2021-02-16

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Hiroyuki Hashimoto, Takafumi Fukushima, Kang Wook Lee, Mitsumasa Koyanagi, Tetsu Tanaka:
Highly efficient TSV repair technology for resilient 3-D stacked multicore processor system. 3DIC 2013: 1-5

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