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"No pumping at 450°C with electrodeposited copper TSV."

Kazuo Kondo et al. (2015)

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DOI: 10.1109/3DIC.2015.7334559

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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  dblp key:
  - conf/3dic/KondoMYO15
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  - https://dblp.org/rec/conf/3dic/KondoMYO15
Kazuo Kondo, Shingo Mukahara, Masayuki Yokoi, Jin Onuki:
No pumping at 450°C with electrodeposited copper TSV. 3DIC 2015: TS4.1.1-TS4.1.4

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