Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"Exploring AMBA AXI on-Chip interconnection for TSV-based 3D SoCs."

Xiongfei Liao, Jun Zhou, Xin Liu (2011)

> Home

Details and statistics

DOI: 10.1109/3DIC.2012.6263036

access: closed

type: Conference or Workshop Paper

metadata version: 2020-05-13

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/3dic/LiaoZL11
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/3dic/LiaoZL11
Xiongfei Liao, Jun Zhou, Xin Liu:
Exploring AMBA AXI on-Chip interconnection for TSV-based 3D SoCs. 3DIC 2011: 1-4

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.