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"Low Temperature Cu to Cu Direct Bonding below 150 °C with Au ..."

Demin Liu et al. (2019)

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DOI: 10.1109/3DIC48104.2019.9058873

access: closed

type: Conference or Workshop Paper

metadata version: 2020-04-19

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  dblp key:
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Demin Liu, Po-Chih Chen, Yi-Chieh Tsai, Kuan-Neng Chen:
Low Temperature Cu to Cu Direct Bonding below 150 °C with Au Passivation Layer. 3DIC 2019: 1-4

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