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"Variation of thermal stress in TSV structures caused by crystallinity of ..."

Jiatong Liu, Ken Suzuki, Hideo Miura (2015)

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DOI: 10.1109/3DIC.2015.7334610

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

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  - conf/3dic/LiuSM15
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Jiatong Liu, Ken Suzuki, Hideo Miura:
Variation of thermal stress in TSV structures caused by crystallinity of electroplated copper interconnections. 3DIC 2015: TS8.5.1-TS8.5.5

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