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"Front-side mid-level Tungsten TSV integration for high-density 3D ..."
Brian Mattis et al. (2016)
- Brian Mattis, Lovelace Soirez, Catherine Bullock, Dave Martini, Sara Jensen, James Levy, Adam Jones:
Front-side mid-level Tungsten TSV integration for high-density 3D applications. 3DIC 2016: 1-4
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