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"Low temperature bonding for 3D interconnects."

Tadatomo Suga, Ryuichi Kondoh (2011)

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DOI: 10.1109/3DIC.2012.6262942

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-29

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Tadatomo Suga, Ryuichi Kondoh:
Low temperature bonding for 3D interconnects. 3DIC 2011: 1-4

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