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"Stress management strategy to limit die curvature during silicon ..."
Benjamin Vianne et al. (2015)
- Benjamin Vianne, Alexis Farcy, Vincent Fiori, Cédrick Chappaz, Norbert Chevrier, G. Lobascio, Pascal Chausse, F. Ponthenier, A. Ruckly, Stephanie Escoubas, Olivier Thomas:
Stress management strategy to limit die curvature during silicon interposer integration. 3DIC 2015: TS11.4.1-TS11.4.7
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