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"Damage evaluation of wet-chemical silicon-wafer thinning process."

Naoya Watanabe et al. (2011)

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DOI: 10.1109/3DIC.2012.6262973

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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  dblp key:
  - conf/3dic/WatanabeMAY11
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  - https://dblp.org/rec/conf/3dic/WatanabeMAY11
Naoya Watanabe, Takumi Miyazaki, Masahiro Aoyagi, Kazuhiro Yoshikawa:
Damage evaluation of wet-chemical silicon-wafer thinning process. 3DIC 2011: 1-4

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