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"Yield analysis of a novel wafer manipulation method in 3D stacking."

Bei Zhang, Baohu Li, Vishwani D. Agrawal (2013)

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DOI: 10.1109/3DIC.2013.6702370

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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  dblp key:
  - conf/3dic/ZhangLA13
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  - https://dblp.org/rec/conf/3dic/ZhangLA13
Bei Zhang, Baohu Li, Vishwani D. Agrawal:
Yield analysis of a novel wafer manipulation method in 3D stacking. 3DIC 2013: 1-8

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