"Application of Wafer Defect Pattern Classification Model in the ..."

Chin-Wei Lee et al. (2023)

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DOI: 10.1109/APSIPAASC58517.2023.10317264

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type: Conference or Workshop Paper

metadata version: 2024-05-07

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Chin-Wei Lee, Daniel Hládek, Matús Pleva, Yuan-Fu Liao, Ming-Hsiang Su:
Application of Wafer Defect Pattern Classification Model in the Semiconductor Industry. APSIPA ASC 2023: 2173-2177

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