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"Chiplet Placement for 2.5D IC with Sequence Pair Based Tree and Thermal ..."
Hong-Wen Chiou et al. (2023)
- Hong-Wen Chiou, Jia-Hao Jiang, Yu-Teng Chang, Yu-Min Lee, Chi-Wen Pan:
Chiplet Placement for 2.5D IC with Sequence Pair Based Tree and Thermal Consideration. ASP-DAC 2023: 7-12
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