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"Three-dimensional integrated circuits (3D IC) floorplan and power/ground ..."

Paul Falkenstern et al. (2010)

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DOI: 10.1109/ASPDAC.2010.5419899

access: closed

type: Conference or Workshop Paper

metadata version: 2017-06-01

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Paul Falkenstern, Yuan Xie, Yao-Wen Chang, Yu Wang:
Three-dimensional integrated circuits (3D IC) floorplan and power/ground network co-synthesis. ASP-DAC 2010: 169-174

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