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"Thermal analysis of semiconductor devices and materials - Why should I not ..."

Martin Kuball et al. (2019)

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DOI: 10.1109/BCICTS45179.2019.8972763

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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Martin Kuball, James W. Pomeroy, Filip Gucmann, Bahar Oner:
Thermal analysis of semiconductor devices and materials - Why should I not trust a thermal simulation ? BCICTS 2019: 1-5

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