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"An Ultra-low-power 28nm CMOS Dual-die ASIC Platform for Smart Hearables."

Yu Pu et al. (2018)

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DOI: 10.1109/BIOCAS.2018.8584806

access: closed

type: Conference or Workshop Paper

metadata version: 2019-01-08

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  - conf/biocas/PuBGXLSFSDNSSGA18
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  persistent URL:
  - https://dblp.org/rec/conf/biocas/PuBGXLSFSDNSSGA18
Yu Pu, Danny Butterfield, Jorge Garcia, Jing Xie, Mark Lin, Rohit Sauhta, Rick Farley, Steve Shellhammer, Moses Derkalousdian, Adam Newham, Chunlei Shi, Ravi Shenoy, Evgeni Gousev, Rashid Attar:
An Ultra-low-power 28nm CMOS Dual-die ASIC Platform for Smart Hearables. BioCAS 2018: 1-4

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