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"High-throughput TSV testing and characterization for 3D integration using ..."

Kapil Dev, Gary L. Woods, Sherief Reda (2013)

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DOI: 10.1145/2463209.2488823

access: closed

type: Conference or Workshop Paper

metadata version: 2021-09-07

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Kapil Dev, Gary L. Woods, Sherief Reda:
High-throughput TSV testing and characterization for 3D integration using thermal mapping. DAC 2013: 73:1-73:6

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