"ChipletEM: Physics-Based 2.5D and 3D Chiplet Heterogeneous Integration ..."

Zeyu Sun et al. (2025)

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DOI: 10.1109/DAC63849.2025.11132600

access: closed

type: Conference or Workshop Paper

metadata version: 2025-09-22

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Zeyu Sun, Weijie Tong, Xiaoning Ma, He Cao, Jianyun Liu, Zhiqiang Li, Qinzhi Xu:
ChipletEM: Physics-Based 2.5D and 3D Chiplet Heterogeneous Integration Electromigration Signoff Tool Using Coupled Stress and Thermal Simulation. DAC 2025: 1-7

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