"Yield and timing constrained spare TSV assignment for three-dimensional ..."

Yu-Guang Chen et al. (2014)

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DOI: 10.7873/DATE.2014.118

access: closed

type: Conference or Workshop Paper

metadata version: 2022-12-13

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Yu-Guang Chen, Kuan-Yu Lai, Ming-Chao Lee, Yiyu Shi, Wing-Kai Hon, Shih-Chieh Chang:
Yield and timing constrained spare TSV assignment for three-dimensional integrated circuits. DATE 2014: 1-4

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