"3-Layer stacked pixel-parallel CMOS image sensors using hybrid bonding of ..."

Masahide Goto et al. (2022)

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DOI: 10.2352/EI.2022.34.7.ISS-258

access: open

type: Conference or Workshop Paper

metadata version: 2024-05-07

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Masahide Goto, Yuki Honda, Masakazu Nanba, Yoshinori Iguchi, Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, Toshiro Hiramoto:
3-Layer stacked pixel-parallel CMOS image sensors using hybrid bonding of SOI wafers. Imaging Sensors and Systems 2022: 1-4

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