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"Thermal stress aware 3D-IC statistical static timing analysis."

Bing Shi, Ankur Srivastava (2013)

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DOI: 10.1145/2483028.2483110

access: closed

type: Conference or Workshop Paper

metadata version: 2021-11-18

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Bing Shi, Ankur Srivastava:
Thermal stress aware 3D-IC statistical static timing analysis. ACM Great Lakes Symposium on VLSI 2013: 281-286

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