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"Reticle floorplanning of flexible chips for multi-project wafers."

Meng-Chiou Wu, Rung-Bin Lin (2005)

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DOI: 10.1145/1057661.1057779

access: closed

type: Conference or Workshop Paper

metadata version: 2018-11-06

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Meng-Chiou Wu, Rung-Bin Lin:
Reticle floorplanning of flexible chips for multi-project wafers. ACM Great Lakes Symposium on VLSI 2005: 494-497

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