BibTeX record conf/hotchips/LinTHHCYFZCLCKT16

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  author    = {Mu{-}Shan Lin and
               Chien{-}Chun Tsai and
               Kenny Cheng{-}Hsiang Hsieh and
               Wen{-}Hung Huang and
               Yu{-}Chi Chen and
               Shu{-}Chun Yang and
               Chin{-}Ming Fu and
               Hao{-}Jie Zhan and
               Jinn{-}Yeh Chien and
               Shao{-}Yu Li and
               Y.{-}H. Chen and
               C.{-}C. Kuo and
               Shih{-}Peng Tai and
               Kazuyoshi Yamada},
  title     = {A 16nm 256-bit wide 89.6GByte/s total bandwidth in-package interconnect
               with 0.3V swing and 0.062pJ/bit power in InFO package},
  booktitle = {2016 {IEEE} Hot Chips 28 Symposium (HCS), Cupertino, CA, USA, August
               21-23, 2016},
  pages     = {1--32},
  publisher = {{IEEE}},
  year      = {2016},
  url       = {},
  doi       = {10.1109/HOTCHIPS.2016.7936211},
  timestamp = {Thu, 02 Apr 2020 09:00:13 +0200},
  biburl    = {},
  bibsource = {dblp computer science bibliography,}
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