"Full-chip Inter-die Parasitic Extraction in Face-to-Face-Bonded 3D ICs."

Yarui Peng et al. (2015)

Details and statistics

DOI: 10.1109/ICCAD.2015.7372631

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

a service of  Schloss Dagstuhl - Leibniz Center for Informatics