"A review on opportunities brought by 3D-monolithic integration for CMOS ..."

François Andrieu et al. (2018)

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DOI: 10.1109/ICICDT.2018.8399776

access: closed

type: Conference or Workshop Paper

metadata version: 2023-08-28

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François Andrieu, Perrine Batude, Laurent Brunet, Claire Fenouillet-Béranger, Didier Lattard, Sébastien Thuries, Olivier Billoint, Richard Fournel, Maud Vinet:
A review on opportunities brought by 3D-monolithic integration for CMOS device and digital circuit. ICICDT 2018: 141-144

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