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"Investigation of Thermal Deformation Characteristics in IGBT Modules Under ..."
Cong Chen et al. (2022)
- Cong Chen, Libing Bai, Jun Luo, Jiahao Wang, Quan Zhou, Jie Zhang, Lulu Tian, Wei Huang
, Yuhua Cheng:
Investigation of Thermal Deformation Characteristics in IGBT Modules Under Bonding Wire Cracking Condition. IECON 2022: 1-6
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