"A highly reliable DRAM 3-D wafer thinning process."

Akram Ditali et al. (2015)

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DOI: 10.1109/IRPS.2015.7112734

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Akram Ditali, Bill Black, Manny Ma, Mike Ball, Guohua Wei, J. Michael Brand:
A highly reliable DRAM 3-D wafer thinning process. IRPS 2015: 4

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