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"Universal Hot Carrier Degradation Model under DC and AC Stresses."

Chu Yan et al. (2022)

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DOI: 10.1109/IRPS48227.2022.9764580

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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  dblp key:
  - conf/irps/YanDQZZ22
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  - https://dblp.org/rec/conf/irps/YanDQZZ22
Chu Yan, Yaru Ding, Yiming Qu, Liang Zhao, Yi Zhao:
Universal Hot Carrier Degradation Model under DC and AC Stresses. IRPS 2022: 7

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